Sputtering of silicon surface by silver-ion implantation

Abstract

© 2019 Elsevier B.V. The article describes the study of Si surface sputtering with the low-energy high-dose implantation by Ag+ ions with energy E = 30 keV and current density J = 8 μA/cm2. The radiation dose was D = 2.5 · 1016–1.5 · 1017 ion/cm2. It was found that the thickness of the spattered Ag:Si layer monotonously increased up to 50 nm when D reached its maximum, and the value of the effective sputtering yield was ~1.6.