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dc.contributor.author | Gumarov A.I. | |
dc.contributor.author | Rogov A.M. | |
dc.contributor.author | Stepanov A.L. | |
dc.date.accessioned | 2021-02-25T21:02:11Z | |
dc.date.available | 2021-02-25T21:02:11Z | |
dc.date.issued | 2020 | |
dc.identifier.issn | 2452-2139 | |
dc.identifier.uri | https://dspace.kpfu.ru/xmlui/handle/net/162951 | |
dc.description.abstract | © 2020 Elsevier Ltd The results of low-energy high-dose implantation of single-crystal c-Si by Cu+ ions at energy 40 keV, current density 8 μA/cm2 and doses of 3.1·1016 and 1.25·1017 ion/cm2 are presented. It was shown that if the dose is low Cu nanoparticles with average diameter of 10 nm are formed in a near-surface implanted Si layer. When the dose is higher Cu ions chemically interact with the Si atoms and the synthesis of the η″-phase Cu3Si instead of Cu nanoparticles is observed. Cu nanoparticles transformation to Cu3Si phase in the sample heated by long time implantation is discussed. | |
dc.relation.ispartofseries | Composites Communications | |
dc.subject | Copper nanoparticles | |
dc.subject | Copper silicide | |
dc.subject | Ion implantation | |
dc.title | Formation of Cu nanoparticles and Cu<inf>3</inf>Si phase in Si by ion implantation | |
dc.type | Article | |
dc.relation.ispartofseries-volume | 21 | |
dc.collection | Публикации сотрудников КФУ | |
dc.source.id | SCOPUS24522139-2020-21-SID85089000316 |