dc.contributor.author |
Gumarov A.I. |
|
dc.contributor.author |
Rogov A.M. |
|
dc.contributor.author |
Stepanov A.L. |
|
dc.date.accessioned |
2021-02-25T21:02:11Z |
|
dc.date.available |
2021-02-25T21:02:11Z |
|
dc.date.issued |
2020 |
|
dc.identifier.issn |
2452-2139 |
|
dc.identifier.uri |
https://dspace.kpfu.ru/xmlui/handle/net/162951 |
|
dc.description.abstract |
© 2020 Elsevier Ltd The results of low-energy high-dose implantation of single-crystal c-Si by Cu+ ions at energy 40 keV, current density 8 μA/cm2 and doses of 3.1·1016 and 1.25·1017 ion/cm2 are presented. It was shown that if the dose is low Cu nanoparticles with average diameter of 10 nm are formed in a near-surface implanted Si layer. When the dose is higher Cu ions chemically interact with the Si atoms and the synthesis of the η″-phase Cu3Si instead of Cu nanoparticles is observed. Cu nanoparticles transformation to Cu3Si phase in the sample heated by long time implantation is discussed. |
|
dc.relation.ispartofseries |
Composites Communications |
|
dc.subject |
Copper nanoparticles |
|
dc.subject |
Copper silicide |
|
dc.subject |
Ion implantation |
|
dc.title |
Formation of Cu nanoparticles and Cu<inf>3</inf>Si phase in Si by ion implantation |
|
dc.type |
Article |
|
dc.relation.ispartofseries-volume |
21 |
|
dc.collection |
Публикации сотрудников КФУ |
|
dc.source.id |
SCOPUS24522139-2020-21-SID85089000316 |
|