The effect of tris(hydroxymethyl)aminomethane on the stability of chemical copper-plating solutions and process rate

dc.contributor.author	Petrova T.
dc.contributor.author	Rakhmatullina I.
dc.contributor.author	Shapnik M.
dc.date.accessioned	2018-09-17T21:53:24Z
dc.date.available	2018-09-17T21:53:24Z
dc.date.issued	1995
dc.identifier.issn	0044-1856
dc.identifier.uri	https://dspace.kpfu.ru/xmlui/handle/net/135564
dc.description.abstract	Novel additive is suggested in ethylendiamintetraacetate solution for chemical copper plating. The additive enables to raise a copper deposition rate more than twice and to improve a solution stability. The reaction orders for the main solution components of copper plating. Effective activation energy and constant of process rate are estimated. Empiric equation is obtained which allows to define the process rate depending upon component concentration and temperature.
dc.relation.ispartofseries	Zashchita Metallov
dc.title	The effect of tris(hydroxymethyl)aminomethane on the stability of chemical copper-plating solutions and process rate
dc.type	Article
dc.relation.ispartofseries-issue	4
dc.relation.ispartofseries-volume	31
dc.collection	Публикации сотрудников КФУ
dc.relation.startpage	410
dc.source.id	SCOPUS00441856-1995-31-4-SID0029333676

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Публикации сотрудников КФУ Scopus [24551]
Коллекция содержит публикации сотрудников Казанского федерального (до 2010 года Казанского государственного) университета, проиндексированные в БД Scopus, начиная с 1970г.